WebH01S5/022; 权利要求说明书 说明书 幅图 (54)发明名称 半导体激光器的封装方法 (57)摘要 本发明属于半导体光电器件的制造技术,涉及对850nmVCSEL半导体激光器进行封装型的半导体激光器封装方法。 半导体激光器封装方法是:a.将VCSEL芯片贴在表面镀金的热沉上,用金丝键合的工艺将芯片正负极引出,再把芯片翻转90°固定;b.利用制冷器 … WebH01S5/022(2006.01) H01S5/026(2006.01) H01S5/042(2006.01) H01S5/42(2006.01) G01S17/00(2006.01) H01S5/02(2006.01) H01S5/062(2006.01) H01S5/183(2006.01) …
(19) TZZ ¥ T
WebH01S5/022 (2006.01)H01S5/0687 H01S5/14(2006.01) (84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA ME (30) Priority: 22.02.2013 US 201313774309 (71) Applicant: EMCORE Corporation … WebC H01S5/005 1 {Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping (H01S5/026, H01S5/18388 take precedence)} H01S5/005, H01S5/0087 . M H01S5/0057 2 {for temporal shaping, e.g. pulse compression, frequency chirping} off grid propane generator
VCSEL ARRAY WITH SMALL PULSE DELAY - European Patent …
Weblaser drive components H01S5/0261)} H01S 5/02438 In the scheme title, insert the word “chip” after the word “laser” so that the title appears as shown below: {Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens} H01S 5/02446 WebH01S5/00 — Semiconductor lasers; H01S5/02 — Structural details or components not essential to laser action; H01S5/024 — Arrangements for thermal management; … WebThe highly integrated multi-channel optical transceiver of a silicon photonic chip according to claim 2, wherein the transimpedance amplifier integrates a CDR and a 28-nm CMOS amplifier and supports a 4×25-Gbps NRZ signal input function and a 4×25-Gbps NRZ rectification signal output function. 9. mycat 1.6.5